METHOD AND APPARATUS FOR BINDING

Japanese Patent JP3427166

B2

PURPOSE: To simplify and miniaturize the structure of a binding apparatus, and to improve efficiency in the binding by a method wherein operation for arranging the binding is executed by a binding tape itself, and the bound matter is taken out from the downside after completion of the binding.
CONSTITUTION: Matters to be bound 6 are placed on a mount table 18 with a binding tape 5 pushed in, then the direction for drawing out the binding tape 5 is tilted toward the side of a tape-holding part 2 with a binding arrangement member 14 tilted, and a binding head 4 is moved forward to the side of the tape-holding part 2 while the binding tape 5 is rewound, and thereby the matters to be bound 6 are arranged in order. Consequently, the structure of the binding apparatus can be simplified and miniaturized. The binding head 4 is butted against the tape holding part 2, and the binding tape 5' is pressed and cut, and the matters to be bound 6 that are arranged in order beforehand are bound. After that, the mount table 18 is retreated, letting the bound matters 6 fall. Thereby, discharge of the bound matters 6 can be facilitated while efficiency in the binding is improved, with the time required for the apparatus to wait for the next binding reduced. A series of stages for binding processes as mentioned above can be automatized, contributing to improvement of efficiency.

Toshimasa Kakita

JP10907294A

July 14, 2003

April 25, 1994

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Nichiban Co., Ltd.

B65B13/08; B65B13/18; B65B13/20; (IPC1-7): B65B13/18; B65B13/20

JP57125108A
JP581612A
JP57149202U

Nobuo Kaida (3 outside)

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