Title:
METHOD AND APPARATUS FOR BONDING PHOTOSENSITIVE RESIN FILM ON BOARD FOR CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPS5649592
Kind Code:
A
Inventors:
SHIOZAKI HARUMI
MIYAMOTO MASAO
WADA YUKIHIKO
FUKUOKA HIROICHI
KONDOU TERUTAKE
SHIMAZAKI YOSHIKAZU
AZUMA YUKIO
MIYAMOTO MASAO
WADA YUKIHIKO
FUKUOKA HIROICHI
KONDOU TERUTAKE
SHIMAZAKI YOSHIKAZU
AZUMA YUKIO
Application Number:
JP12588179A
Publication Date:
May 06, 1981
Filing Date:
September 29, 1979
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
G03C1/74; G03F7/16; H05K3/00; H05K3/06; (IPC1-7): G03C1/74; G03F7/16; H05K3/00
Previous Patent: 電気めっき用保持具およびこの保持具を用いた電気めっき装置
Next Patent: METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
Next Patent: METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD