Title:
METHOD AND APPARATUS FOR BUMP FORMING
Document Type and Number:
Japanese Patent JP2000031181
Kind Code:
A
Abstract:
To provide a bump forming apparatus, with which the temperature control different from the conventional one is performed when a bump is formed on a semiconductor wafer, and to provide the bump forming method performed on the bump forming apparatus.
This bump forming apparatus 101 is provided with a transfer device 140 and a control device 180, and after formation of a bump which is held by the transferring device, a wafer 202 is arranged above the bonding stage, and the temperature drop of the wafer is controlled. As a result, the generation of nonconformities such as cracks, etc., caused by thermal stresses can be prevented even for a compound semiconductor wafer which is sensitive to the change of temperature.
Inventors:
IMANISHI MAKOTO
NARITA MASACHIKA
IKETANI MASAHIKO
KANAYAMA SHINJI
MAE TAKAHARU
NARITA MASACHIKA
IKETANI MASAHIKO
KANAYAMA SHINJI
MAE TAKAHARU
Application Number:
JP17308698A
Publication Date:
January 28, 2000
Filing Date:
June 19, 1998
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Aoyama Ryo (2 outside people)
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