Title:
METHOD AND APPARATUS FOR BUNDLING
Document Type and Number:
Japanese Patent JP3203453
Kind Code:
B2
Abstract:
PURPOSE: To drop an object completed with bundling to an original position after a mount is retreated by pushing in to mount a bundling tape with the object to be bundled pulled out from a stage where a head is retreated while the object can be bundled, winding the tape and press-fitting it to be cut.
CONSTITUTION: By pushing in to mount a bundling tape 5 with an object 6 to be bundled pulled out onto a mount 18, a start valve is pressed, a pressing member 14 is tilted to fix the object 6 on the mount 18, then a head 4 advances to wind the bundling tape 5 around the object 6, then the head 4 is brought against a tape holding part 2 to have the tape 5 press-fitted and cut, after bundling the mount 18 is retreated, and the object 6 which has completed with bundling is dropped. Even if the bundling tape has been pulled out between the tape holding part and the head, the object can be taken out efficiently, and automation of bundling is easy.
Inventors:
Toshimasa Kakita
Application Number:
JP20588393A
Publication Date:
August 27, 2001
Filing Date:
July 28, 1993
Export Citation:
Assignee:
Nichiban Co., Ltd.
International Classes:
B65B13/04; B65B13/18; (IPC1-7): B65B13/04; B65B13/18
Domestic Patent References:
| JP58112908A | ||||
| JP59174416A | ||||
| JP60193809A | ||||
| JP5538272A | ||||
| JP57123705U |
Attorney, Agent or Firm:
Nobuo Kaida (2 outside)