Title:
METHOD AND APPARATUS FOR CLEANING ELECTRONIC PART
Document Type and Number:
Japanese Patent JP2005238059
Kind Code:
A
Abstract:
To provide a method and an apparatus for grinding and removing an attached substance such as an adhesive wax, a resist, or a bur used in the wafer process and mechanical working of a CPP-GMR (current perpendicular to plane-giant magneto resistive) head and TMR (tunneling magneto resistive) head to be used in the wafer process and mechanical working process for electronic parts, specially a next-generation HDD (hard disk drive).
For cleaning the attached substance, an apparatus which has a nozzle for irradiating an object with fine carbon dioxide particles formed by adiabatic expansion of a liquid carbon oxide and coarse carbon dioxide particles formed by mechanical crushing of a dry ice, simultaneously or with a time lag, is used.
More Like This:
| WO/2020/021085 | SCRAPER HEAD AND SCRAPER CLEANING |
| WO/2018/098604 | WALL CORNER WASHING APPARATUS |
| JP2010125466 | METHOD OF MANUFACTURING PLATE WITH EXTREMELY SMALL PERFORATION WORKED THEREIN |
Inventors:
MOMOTSUKA YUICHI
MAEKAWA MITSUGI
TOKUSHIMA TADAO
MAEKAWA MITSUGI
TOKUSHIMA TADAO
Application Number:
JP2004049402A
Publication Date:
September 08, 2005
Filing Date:
February 25, 2004
Export Citation:
Assignee:
MEDIKEN INC
International Classes:
B08B1/00; H01L21/304; B08B7/00; (IPC1-7): B08B7/00; B08B1/00; H01L21/304
Attorney, Agent or Firm:
Mitsumasa Ishii
Previous Patent: MAGNETIC WATER TREATMENT APPARATUS
Next Patent: ORGANIC COMPOUND OXIDIZING CATALYST AND METHOD OF OXIDIZING ORGANIC COMPOUND
Next Patent: ORGANIC COMPOUND OXIDIZING CATALYST AND METHOD OF OXIDIZING ORGANIC COMPOUND