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Title:
METHOD AND APPARATUS FOR COATING BOARD-SHAPED MOLDED MEMBER MATERIAL ON BOTH SIDES
Document Type and Number:
Japanese Patent JPH06198244
Kind Code:
A
Abstract:

PURPOSE: To miniaturize an apparatus and to dispense with an additional transverse conveyor by transporting a printed circuit board in opposite directions through two coating stations which are arranged side by side in two parallel lines of apparatus, turning the board over and transporting the board from one line to another line after turning over.

CONSTITUTION: In the first coating station 4, one side of the printed circuit board 2 is wet-coated at first, the board is subjected to vapor-removal and drying in a first vapor-removal and drying station 5, is turned over and in the second coating station 6, second side is wet-coated. The printed circuit board 2 both sides of which are coated is subjected to vapor-removal and drying in a second vapor-removal and drying station 7. The board is finally transferred from a coating apparatus 1 to another processing apparatus for further processing. In this apparatus, the printed circuit board 2 is transported in opposite directions X, Y through the two coating stations 4, 6 arranged side by side in two parallel lines A, B of the apparatus and at the station 5, the board is transported from the first line A to the second line B.


Inventors:
KASUPAARU KUSUTAA
ANTON RIYUETSUGE
Application Number:
JP26423693A
Publication Date:
July 19, 1994
Filing Date:
September 28, 1993
Export Citation:
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Assignee:
CIBA GEIGY AG
International Classes:
B05C13/02; B05C9/04; G03F7/16; G11B7/26; H05K3/00; H05K3/28; B05C5/00; H05K3/22; B05C; G03F; H05K; (IPC1-7): B05C9/04; B05C13/02; G03F7/16; H05K3/28
Attorney, Agent or Firm:
Nobuo Kaida (2 outside)