To provide a method and apparatus for polishing and planarizing workpieces such as semiconductor wafers.
The apparatus 200 is used to condition polishing pad 126 used for polishing a precision surface of a workpiece and covering a platen attached to a polishing machine, and the apparatus contains: a means which conditions the polishing pad by coming in contact with the polishing pad and the conditioning means being arranged together with a cutting element 205 fixed to the bottom surface of the conditioning means; a means in which the fixed cutting element is coated with a composition for reducing breakage of the cutting element; and a means engaging the conditioning means with the polishing pad, rotating the conditioning means, and vibrating the conditioning means over the peak surface of the polishing pad.
Takaaki Yasumura
Natsuki Morishita