PURPOSE: To provide a wafer cooler of a slicing machine and its wafer cooling method wherein coiling operation of a wafer in cutting is accelerated, and further precision in working can be improved.

CONSTITUTION: When a wafer is manufactured by cutting a rod like work 12 with a blade 2, cooling efficiency on the wafer is raised by supplying coolant directly onto an end face of the work 12 from a coolant discharging member or a wafer recovery pad 18. Further, the wafer in cutting is supported with coolant supplied onto the end face of the work 12, and flow rate of the coolant is controlled in that case. By adjusting easily a balance between force wherein the wafer is supported with the coolant and empty weight of the wafer thereby, precision in working of the wafer is improved.