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Title:
METHOD AND APPARATUS FOR CRUSHING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2001025679
Kind Code:
A
Abstract:

To crush a printed wiring board simply and inexpensively and to separate/recover part of electronic parts and coated wires surely by providing a process in which the board is cooled to make it hard and fragile and a process in which the cooled board is crushed in a size of a prescribed square.

When a printed wiring board 20 is crushed, the board, after being cooled at 0°C, preferably at -20 to -40°C to make it hard and fragile, is crushed in a size of about 10 cm square. As a crusher 100, a horizontal shaft 2 is installed on the inside of a cylindrical case 1, a rotor 3 which is rotated by a motor 8 is installed on the inner bottom surface of the case 1, and a conical projection 6 and vertical shafts 4, 5 are installed on the upper surface of the rotor 3. The board 20 is impact-crushed by the collaboration of the shafts 2, 4, 5.


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Inventors:
HISAKADO TAKAO
KAMIMURA TAKESHI
SHIMIZU KAORU
TERADA NOBUO
FURUYA YOSHIAKI
Application Number:
JP20306399A
Publication Date:
January 30, 2001
Filing Date:
July 16, 1999
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
B02C13/22; B02C19/00; B02C19/18; B02C23/00; B09B5/00; B09B3/00; (IPC1-7): B02C19/18; B02C13/22; B02C19/12; B02C23/00; B09B3/00; B09B5/00
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)



 
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