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Title:
METHOD AND APPARATUS FOR CUTTING ELECTRICAL WIRING ON SUBSTRATE, AND METHOD AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2003200279
Kind Code:
A
Abstract:

To surely insulate an electrical wiring formed on a substrate from another electrical wiring in a short period of time.

The apparatus for cutting an electrical wiring 10 is provided with a laser generator 1 which generates a laser beam, an optical beam branching element 3 for branching a laser beam generated by the laser generator 1 into a plurality of branch beams, and a condenser element for condensing the branch beams branched by the optical beam branching element 3 (the optical beam branching element 3 can also serve as the condenser element). The condenser element may be a condenser lens which is separate from the optical beam branching element 3. Further, the power and the focal depth of the branch beam may be adjusted. When the substrate has a transparency to the laser beam, the branch beam is directed to the electrical wiring line formed on the substrate from the opposite side to the surface having the electrical wiring.


Inventors:
UMETSU KAZUNARI
AMAKO ATSUSHI
HONDA KENICHI
Application Number:
JP2002257909A
Publication Date:
July 15, 2003
Filing Date:
September 03, 2002
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B23K26/064; B23K26/067; B23K26/12; B23K26/351; B23K26/361; G02F1/1345; H01L21/3205; H01L21/768; G02F1/1343; H01L23/52; H01L23/522; H01L51/50; H05B33/10; B23K101/36; G02F1/1362; H05K3/02; H05K3/22; (IPC1-7): B23K26/00; B23K26/06; B23K26/12; G02F1/1343; G02F1/1345; H01L21/3205; H05B33/10; H05B33/14
Attorney, Agent or Firm:
Muneharu Sasaki (3 outside)