Title:
METHOD AND APPARATUS FOR CUTTING PATTERN
Document Type and Number:
Japanese Patent JPH04320391
Kind Code:
A
Abstract:
PURPOSE: To provide a cutting apparatus which cuts the desired points of a pattern formed on a printed board and which does not damage an adjacent or lower pattern.
CONSTITUTION: Using an ultrasonic cutter 10, two points P1 and P2 of a pattern 2 which are formed on the surface of a printed board 1 and which are apart from each other by a certain distance are cut, and after the copper foil between P1 and P2 has been heated, copper foil 2A is peeled to complete the procedure.
Inventors:
SHINJO MAMORU
HOSOYA KIMIO
HOSOYA KIMIO
Application Number:
JP8795891A
Publication Date:
November 11, 1992
Filing Date:
April 19, 1991
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
B21D33/00; H05K3/22; (IPC1-7): B21D33/00; H05K3/22
Attorney, Agent or Firm:
Sadaichi Igita