Title:
METHOD AND APPARATUS FOR DIAGNOSIS OF SERVICE LIFE OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP3400362
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a method and an apparatus, in which the remaining service life of an electronic device can be evaluated quantitatively and nondestructively, easily and accurately, while the function of the electronic device is being maintained by a method, wherein an electronic control board is divided into a plurality of groups so as to be extracted arbitrarily, the performance of a material for the board is measured and the extreme value statistics of the distribution of measured values are taken.
SOLUTION: When the surface resistance and the volume resistivity of an electronic control board 11 are measured as the performance of a material for the board, an insulation-resistance measuring device 12 is used. When they are measured, a circular electrode is created in an empty space 11a on the board 11, by using a conductive silver paint or the like. When volume resistivity is measured, a voltage is applied across an inner circle 13a on an upper-part electrode and a lower-part electrode 13c. When the surface resistance is measured, a voltage is applied across the inner circle 13a and an outer circle 13b. The volume resistivity and the surface resistance are measured by a comparison method or the like, with respect to a standard resistor Rs. Then, the extreme-value statistics of the distribution of reference- material-performance measured values obtained by their measurements are taken. Their minimum value or their maximum value is estimated, and the remaining service life of the electronic control board is evaluated quantitatively on the basis of a time-series change in an estimated value and on the basis of a limit value which is defined by a standard.
Inventors:
Keiichi Sasaki
Application Number:
JP29866098A
Publication Date:
April 28, 2003
Filing Date:
October 20, 1998
Export Citation:
Assignee:
Toshiba Corporation
International Classes:
G01N17/00; G01R31/00; G01R31/26; H01G13/00; (IPC1-7): G01R31/00; G01N17/00; G01R31/26; H01G13/00
Domestic Patent References:
| JP611530A | ||||
| JP9304461A | ||||
| JP7249840A | ||||
| JP886826A | ||||
| JP63115771U | ||||
| JP2672U |
Other References:
佐々木恵一、南裕二、安達健二、熊丸智雄，ＩＣのアルミ配線腐食を劣化指標とする診断法，日本信頼性学会誌 信頼性 ，日本，日本信頼性学会，１９９６年１１月１０日，１９９６年１１月号Ｖｏｌ．１８／Ｎｏ．７／通巻７７号，７５−７８
Attorney, Agent or Firm:
Hidekazu Miyoshi (7 outside)
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