METHOD AND APPARATUS FOR DIVIDING SAPPHIRE SUBSTRATE

Title:

METHOD AND APPARATUS FOR DIVIDING SAPPHIRE SUBSTRATE

Document Type and Number:

Japanese Patent JP3895287

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To provide a method for efficiently dividing a sapphire substrate in a high yield at a low cost, and an apparatus therefor.
SOLUTION: The method for dividing the sapphire substrate includes a first step for forming scribed grooves 11 to the first surface 10a of the sapphire substrate 10 and a second step for irradiating the positions 11' corresponding to the formed scribed grooves 11 with a laser beam 32 from the first surface 10a side or second surface 10b side of the sapphire substrate. The laser beam 32 has a wavelength enabling the sapphire substrate 10 to yield multiphoton absorption including two-photon absorption and the irradiation energy of the laser beam 32 is the breakdown energy of the sapphire substrate 10.

Inventors:

Hiroaki Misawa
Etsuo Koyama

Application Number:

JP2003059317A

Publication Date:

March 22, 2007

Filing Date:

March 06, 2003

Export Citation:

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Assignee:

Hiroaki Misawa
Techdia Co., Ltd.

International Classes:

B28D5/00; B23K26/38; B23K26/40; C03B33/09; C30B29/20; C30B33/00; H01L21/301; B23K101/40; (IPC1-7): B28D5/00; B23K26/00; C03B33/09; C30B29/20; C30B33/00; H01L21/301; //B23K101:40

Domestic Patent References:

JP2003017790A
JP2003002676A
JP2001151525A
JP2004536759A
JP2003010991A
JP2001176820A
JP2002192370A
JP2004087663A

Attorney, Agent or Firm:

Takashiro Kojima
Noriko Kawai
Takuya Sato

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