Title:
METHOD AND APPARATUS FOR ELECTROPLATING BY FORMATION OF DOUBLE ELECTRODE
Document Type and Number:
Japanese Patent JPS6386885
Kind Code:
A
Abstract:
PURPOSE:To electroplate one side of a conductor without masking by placing the cathode and the anode in a plating soln., putting the conductor in the soln. so that it confronts the anode and supplying electric current. CONSTITUTION:The anode 12 and the cathode 13 are placed opposite to each other in a plating bath 15 in a plating cell 11, a conductor 14 as a body to be plated is put in the bath 15 so that it confronts the anode 12 and then electric current is supplied to the anode 12 and the cathode 13. The side 14a of the conductor 14 confronting the anode 12 is negatively charged and the side 14b confronting the cathode 13 is positively charged, so a desired metallic film is formed on only the cathode side 14b. Thus, one-side plating can be carried out without requiring masking.
Inventors:
KONISHI HARUO
FUKUOKA KATSUHIRO
FUKUOKA KATSUHIRO
Application Number:
JP23003386A
Publication Date:
April 18, 1988
Filing Date:
September 30, 1986
Export Citation:
Assignee:
KOSAKU KK
International Classes:
C25D5/00; C25D17/10; C25D21/00; (IPC1-7): C25D5/00; C25D17/10; C25D21/00
Domestic Patent References:
| JP38008957A |
Attorney, Agent or Firm:
Nobuyuki Fukuda