PURPOSE: To properly and quantitatively extract a failure mode which is peculiar to a surface-mounting type electronic component with reference to the deformation of a board when the surface-mounting type electronic component is mounted on the board or after it has been mounted on the board.

CONSTITUTION: A surface-mounting type electronic component 1 is mounted on a board 10, a specimen 20 under test is formed. Both ends of the board 10 are supported; a load is applied continuously to the board 10 by using a load application apparatus 23; the board 10 is bent. At this time, the magnitude, the speed and the like of the load of the load application apparatus 23 are controlled by using a control unit 25. The electric characteristic of the surface- mounting type electronic component 1 is measured by means of an electric- characteristic measuring apparatus 26 via a connector 12 attached to the board 10. At the same time, its mechanical characteristic is measured by means of a strain gauge 4 which has been brought close to the surface of the surface- mounting type electronic component 1.