PURPOSE: To expose substrates of different sizes by the same apparatus by dividing the upper surface of the substrate into a plurality of regions, sequentially exposing a plurality of positions of one region, then altering the relative position of the substrate and an X-Y stage, and repeating the exposing operation.
CONSTITUTION: A wafer stage having stage WY movable in Y direction, a stage WX movable in X direction and a stage θZ rotatable at θ and movable in Z direction is placed on a substrate WD. A wafer W1 is placed by a hand HA on a chuck WC, and XY stages WX, WY are moved to expose the wafer W1 while moving the XY stage sequentially to one of a plurality of divided regions. When the exposure of the first region is finished, the XY stage is moved, the wafer W1 is raised by the hand YC on the way, the second region is disposed at the exposing position, an the exposing operation is again executed.
TOKUDA YUKIO
JPS618923A | 1986-01-16 |