To provide a method and apparatus for forming a three-dimensional circuit board having a mechanism which can suppress a gap when the circuit board is stuck on the surface of a cylindrical roller especially over the entire circumference.

The apparatus is equipped with a rotation mechanism (10) which holds a cylindrical object (1) to keep its axis horizontal, rotates it with the axis set as the rotary shaft, and can change the direction of the axis within a range of 0-10, a holding mechanism (20) which holds an adhesive film with a separator to turn its exposed adhesive layer downward and conveys it horizontally, and a control mechanism (30) which can adjust a relative positional relationship to make the adhesive film to be conveyed or the circuit board (2) be contacted with the surface of the rotating object (1) and control a pressure applied to the surface of the object (1) to be constant.