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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR HEAT TREATMENT
Document Type and Number:
Japanese Patent JP2004022992
Kind Code:
A
Abstract:

To provide a method and apparatus for a heat treatment, capable of efficiently and continuously processing a plurality of substrates by preventing a damage on the substrates or deflection of them which is caused by an abrupt temperature changes or local heating.

There are provided a housing 51 comprising a carry-in post 52 and/or carry-out port 53 of a substrate G, a substrate stage 56 on which the substrate G carried in through the carry-in port 52 of the housing 51 is placed, a circulation drive part 70 to circulate the substrate stage on which the substrate G is placed while keeping it horizontal, and a heating source 54 which is disposed in the housing 51 and bakes the substrate G with applied heat which is circulated by the circulation drive part 70 for gradual approach.


Inventors:
TERADA KAZUO
Application Number:
JP2002178940A
Publication Date:
January 22, 2004
Filing Date:
June 19, 2002
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/027; (IPC1-7): H01L21/027
Attorney, Agent or Firm:
Kinoshita Shigeru