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Title:
METHOD AND APPARATUS OF ILLUMINATING IC PACKAGE FOR INSPECTION
Document Type and Number:
Japanese Patent JPH07318503
Kind Code:
A
Abstract:

PURPOSE: To easily and effectively illuminate a package to be inspected irrespec tive of the size of the package by disposing dimming elements which can in dependently dim in a two-dimensional manner, and dimming the elements accord ing to an area region responsive to the size of the package.

CONSTITUTION: LED elements (dimming elements) 10-1-10-N of about 3mm×3mm formed on its upper surface in a square shape are disposed in a two-dimensional matrix state to form a dimming element member 10. When an IC package 1 to be inspected is placed on an illuminating stage set above the elements 10 and the type name of the package 1 to be inspected is input from an input unit 18, a control circuit 14 reads the pattern of the illuminating area responsive to the type and the size from a memory 16, controls an LDE driver 12 to light the elements 10-1-10-N, thereby illuminating the package 1. Thus, since the region which does not exceed the end of the connecting part of the lead pin of the package 1 is illuminated, the excellent silhouette image of the end of the pin can be observed.


Inventors:
AZUMA KATSUHISA
KOMATSU YASUO
Application Number:
JP11482994A
Publication Date:
December 08, 1995
Filing Date:
May 27, 1994
Export Citation:
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Assignee:
SANKYO SEIKI SEISAKUSHO KK
International Classes:
G01B11/24; G01N21/01; G01N21/88; G01N21/956; H01L21/66; (IPC1-7): G01N21/88; G01B11/24; G01N21/01; H01L21/66
Attorney, Agent or Firm:
Toru Kabayama (1 person outside)