Title:
METHOD AND APPARATUS FOR INSPECTING FILM CARRIER TAPE FOR MOUNTING ELECTRONIC PART
Document Type and Number:
Japanese Patent JP2002039967
Kind Code:
A
Abstract:
To provide an inspection method and an inspecting apparatus whereby failures of wiring patterns of film carrier tapes for mounting electronic parts can be highly accurately inspected after a solder resist layer is set.
In the method for inspecting failures of the wiring patterns by fetching image data of the wiring patterns of the film carrier tapes for mounting electronic parts, failures are inspected with the use of X-ray image data obtained by irradiating the film carrier tape T with X rays from an X-ray source 33 and receiving passing X rays by an X-ray camera 34.
Inventors:
Nishiyama, Toshihito
Hasegawa, Koji
Hasegawa, Koji
Application Number:
JP2000000228469
Publication Date:
February 06, 2002
Filing Date:
July 28, 2000
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD
International Classes:
G01N23/04; H01L21/60; H05K3/00; G01N23/02; H01L21/02; H05K3/00; (IPC1-7): G01N23/04; H01L21/60; H05K3/00
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