Title:
METHOD AND APPARATUS FOR INSPECTING PRINTED BOARD
Document Type and Number:
Japanese Patent JP3191205
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus whereby a failure of a bare board can be inspected simply by erecting one probe to one signal line on a circuit (corresponding to one pattern of a printed board) so that a count of necessary probes is reduced, the need for using a specially thin probe is decreased, and a count of probes required to have high position accuracy is lessened.
SOLUTION: In a method for inspecting a printed board without an electronic component mounted thereon with the use of a probe 4 to be electrically connected to patterns 2, 3 of the printed board 1 and members 6, 7 having one faces at the side of the printed board formed of an insulating layer and the other faces formed of a conductive layer, the probe 4 is brought to butt against the pattern 2 of the printed board 1, while the members 6, 7 are butted to different places of the pattern 2. A capacitor capacity between the probe 4 and conductive layer is measured, thereby inspecting a disconnection of the pattern 2.
Inventors:
Masatoshi Kato
Application Number:
JP8628897A
Publication Date:
July 23, 2001
Filing Date:
April 04, 1997
Export Citation:
Assignee:
Icy Corporation
International Classes:
G01R31/02; G01R31/28; G01R1/06; (IPC1-7): G01R31/02; G01R1/06; G01R31/28
Domestic Patent References:
| JP62220876A |
Attorney, Agent or Firm:
Hiroshi Dobashi