Title:
METHOD AND APPARATUS FOR IRRADIATING LASER BEAM, METHOD AND APPARATUS OF MICRO MACHINING, AND METHOD AND APPARATUS FOR FORMING THIN FILM
Document Type and Number:
Japanese Patent JP2005212013
Kind Code:
A
Abstract:
To efficiently perform separation at an atomic and molecular level and ionization (i.e. desorption ionization) at the atomic and molecular level, for example, on the surface of a solid.
The value of an irradiation fluence, which is related to a femto-second laser beam in a low fluence region causing non-thermal ionization discharge on the surface of the solid by being irradiated thereon, is set within a low fluence range according to a required separation depth separated from the surface of the solid and the property of the surface of the solid. The femto-second laser beam is irradiated on the surface of the solid with the value of the irradiation fluence set as described above.
Inventors:
SAKABE SHUJI
TAKANO MIKIO
HASHIDA MASAKI
SHIMIZU SEIJI
TAKANO MIKIO
HASHIDA MASAKI
SHIMIZU SEIJI
Application Number:
JP2004020536A
Publication Date:
August 11, 2005
Filing Date:
January 28, 2004
Export Citation:
Assignee:
UNIV KYOTO
International Classes:
B82B3/00; B23K26/00; C23C14/28; (IPC1-7): B82B3/00; C23C14/28
Domestic Patent References:
| JP2003230978A | 2003-08-19 | |||
| JP2002205179A | 2002-07-23 |