Title:
METHOD AND APPARATUS FOR LASER MACHINING
Document Type and Number:
Japanese Patent JP2014166651
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To improve micromachining by enhancing control of laser processing.SOLUTION: Laser processing is enhanced by using endpointing or by using a charged particle beam together with a laser. The end-pointing uses emissions, such as photons, electrons, ions, or neutral particles, from the substrate to determine when the material under the laser has changed or is about to change. Material removed from a sample can be deflected to avoid deposition onto the laser optics.
Inventors:
STRAW MARCUS
TOTH MILOS
UTLAUT MARK
NARUM DAVID H
GUIDO KNIPPELS
GERARDUS NICOLAAS ANNE VAN VEEN
TOTH MILOS
UTLAUT MARK
NARUM DAVID H
GUIDO KNIPPELS
GERARDUS NICOLAAS ANNE VAN VEEN
Application Number:
JP2014094307A
Publication Date:
September 11, 2014
Filing Date:
April 30, 2014
Export Citation:
Assignee:
FEI CO
International Classes:
B23K26/00; B23K15/02; B23K26/12; G01N23/225
Domestic Patent References:
JPH01304648A | 1989-12-08 | |||
JPH09265931A | 1997-10-07 | |||
JPS60114753A | 1985-06-21 | |||
JP2008068275A | 2008-03-27 | |||
JP2001319613A | 2001-11-16 | |||
JP2002336986A | 2002-11-26 |
Attorney, Agent or Firm:
Masahiko Amegai
Previous Patent: LASER IRRADIATION DEVICE AND LASER IRRADIATION METHOD
Next Patent: WIRE ELECTRICAL DISCHARGE MACHINING DEVICE
Next Patent: WIRE ELECTRICAL DISCHARGE MACHINING DEVICE