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Title:
METHOD AND APPARATUS FOR MANUFACTURING BAND MATERIAL FOR PACKAGING SMALL COMPONENT AND BAND MATERIAL FOR PACKAGING SMALL COMPONENT
Document Type and Number:
Japanese Patent JP2001348009
Kind Code:
A
Abstract:

To provide a carrier tape which hardly causes such problems as levitation and vibration during running.

This method is to manufacture a small component packaging band material 10 which stores a small component in each of many storing recesses 14 disposed along the longitudinal direction of the band material 10 and which packages it by covering the surface of the storing recess 14 with a covering tape. With respect to the band material 10 made of a flexible material, which has compression formability, the storing recess 14 is formed by pressing a forming projected form 34 having a shape corresponding to the storing recess 14 against one face of the band material 10. Simultaneously, by pressing a correcting projected form 44 having an outer shape larger than that of the storing recess 14 against the opposite face of the band material 10, the rear face of the small component packaging band material 10 is prevented from bulging out.


Inventors:
MISAWA YOSHIHIKO
ASAO YUKIHIKO
Application Number:
JP2000169562A
Publication Date:
December 18, 2001
Filing Date:
June 06, 2000
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD
NISSHO KK
International Classes:
B65D73/02; B65B15/04; B65D85/86; (IPC1-7): B65B15/04; B65D73/02; B65D85/86
Domestic Patent References:
JP2001171726A2001-06-26
Attorney, Agent or Firm:
Takehiko Matsumoto