METHOD AND APPARATUS FOR MANUFACTURING HIGH PURITY THERMALLY-CONDUCTIVE POLYMER LAYER

Title:

METHOD AND APPARATUS FOR MANUFACTURING HIGH PURITY THERMALLY-CONDUCTIVE POLYMER LAYER

Document Type and Number:

Japanese Patent JPH023303

Kind Code:

A

Abstract:

PURPOSE: To mold a polymer layer having no gas bubble and no surface cavity by forming a mold for forming a mold cavity having desired shape and size of the layer, evacuating the mold cavity, injecting resin for the layer in the cavity, and curing it.

CONSTITUTION: A gasket 104 and a mold member 110 are mounted at a platen 34 to form a mold cavity. A resin filled in a tank is placed in a container 76. The container 76 is sealed by a cover 78. A valve 96 is opened to evacuate a mold cavity 114 and the container 76. A tube 82 is sunk in resin 88. The valve 96 is closed to inject the resin in the cavity 114 by a pressure source 94, and then a valve 92 is opened. And, the resin is cured, and the gasket 104 and the member 110 are removed. The platen 34 and a polymer layer 30 attached thereto are subjected to an oxygen plasma treatment to form a surface film.

Inventors:

ERITSUKU ROORINGU MIAAZU

Application Number:

JP18689A

Publication Date:

January 08, 1990

Filing Date:

January 05, 1989

Export Citation:

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Assignee:

VARIAN ASSOCIATES

International Classes:

B29C39/26; C23C14/50; C30B25/10; B29C39/02; C30B31/12; C30B31/22; H01J37/317; H01L21/00; H01L21/265; B29L31/00; (IPC1-7): B29C39/02; B29C39/26; H01J37/317; H01L21/265

Attorney, Agent or Firm:

Sumio Takeuchi (2 outside)

Next Patent: FITTING INSTRUMENT OF OPTICAL COMPONENT AND MANUFACTURE THEREOF