To manufacture shoes with high productivity.

While an insole is disposed on a last 20 as the last 20 is attached to a last holder 15, hot-melt adhesives is interposed between the insole and last 20. Next, an ultrasonic wave horn 14 is pushed against a portion of the insole corresponding to the hot-melt-adhesives to melt the hot-melt adhesives by ultrasonic wave vibration and temporarily bond the insert to the last 20. While the insert is bonded to the last 20, the insert is covered with an upper part to bond the upper part to the outer surface peripheral part. As the basic configuration of shoes are thus molded with the upper part and insole, when it is removed from the last 20, the ultrasonic wave horn 14 is again pushed against the position corresponding to the hot-melt adhesives of the insert to melt the adhesives. Under such condition, the insert and upper part can be removed from the last 20.