Title:
METHOD AND APPARATUS FOR MANUFACTURING WOODEN CHIP BOARD
Document Type and Number:
Japanese Patent JP3498047
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To manufacture a light weight wooden chip board by use of a waste material or a synthetic resin waste.
SOLUTION: A wooden chip A is supplied from a hopper 1 to a screw feeder 2. Hot wind is blown from a hot wind generator 3 to the screw feeder 2 to dry the chip while a synthetic resin raw material chip B thrown from a hopper 4 to an extruder 5 is melt, is supplied to a mixing block 10 and is mixed with a compressed gas from a pump 6 to contain many micro pores. The molten resin is scattered from a scattering machine 7 on the wooden chip A in the screw feeder 2 and is extruded in a plate shape from a nozzle 8.
Inventors:
Mitsuru Suetomi
Masanori Ukai
Masanori Ukai
Application Number:
JP2000238283A
Publication Date:
February 16, 2004
Filing Date:
August 07, 2000
Export Citation:
Assignee:
Sutomi Engineering Co., Ltd.
International Classes:
B27N3/02; B01F3/04; B01F5/00; B05B1/02; B29C48/04; B29C48/39; B29C48/395; B29C48/535; B65G33/14; B29K105/04; B29K105/16; B29K511/14; B29L7/00; B29L31/10; (IPC1-7): B29C47/10; B27N3/02; B29C47/08; B29C47/78; B65G33/14
Domestic Patent References:
| JP200236335A |
Attorney, Agent or Firm:
Bunji Kamata (2 outside)