Title:
METHOD AND APPARATUS FOR MEASURING FILM THICKNESS OF SUBSTRATE, AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP3854056
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and apparatus for measuring the film thickness of a substrate, of which the constitution is simple and capable of measuring in real time with high accuracy the film thickness of the substrate being subjected to a process such as polishing, and substrate processing device equipped with the apparatus.
SOLUTION: The apparatus includes a water ejection nozzle 5 for causing a columnar water jet 4 to abut against the surface 2a to be measured of the substrate 1, an optical system for applying light to the surface 2a to be measured of the substrate 1 through an illuminating fiber 7 and the water jet 4 and for receiving the light reflected by the surface 2a to be measured of the substrate 1 through the water jet 4 and a receiving fiber 8, and a measurement and computing part 9 for measuring the film thickness of the surface to be measured from the strength of the reflected light received by the optical system.
Inventors:
Shunsuke Nakai
Toshifumi Kinma
Toshifumi Kinma
Application Number:
JP2000315212A
Publication Date:
December 06, 2006
Filing Date:
October 16, 2000
Export Citation:
Assignee:
Ebara Corporation
International Classes:
G01B11/06; B24B37/013; B24B49/12; H01L21/304; H01L21/306; H01L21/66; (IPC1-7): G01B11/06; B24B37/04; H01L21/304; H01L21/306; H01L21/66
Domestic Patent References:
| JP10223578A | ||||
| JP10335288A |
Attorney, Agent or Firm:
Takashi Kumagai
Yu Takagi
Yu Takagi