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Title:
METHOD AND APPARATUS FOR MEASURING MOLD RELEASING FORCE OF MOLDED ITEM
Document Type and Number:
Japanese Patent JP3459631
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To measure an accurate mold releasing force.
SOLUTION: Load added to an ejector mechanism when the ejector mechanism is driven without conducting molding operation comes from an inner resistance within a mold as shown by the thick line L1. The inner resistance includes a spring force (a dashed line L3) to restore an ejecting pin and the like to a position before starting ejection of a molded item and a friction force generated by movement of the ejector mechanism. When molding is conducted and the ejector mechanism is driven, the load becomes a sum of a mold releasing force to eject the molded item from the mold and the inner resistance as shown by the thin line L2. Therefore only the mold releasing force can be obtained by reducing the thick line from the thin line to enable the measurement of the accurate mold releasing force. Goodness of the molded item, goodness of a molding operation, abnormality of the ejector mechanism and the like can be accurately detected by the measured mold releasing force.


Inventors:
Keno Kamiguchi
Tatsuhiro Uchiyama
Hiroshi Watanabe
Application Number:
JP2000343141A
Publication Date:
October 20, 2003
Filing Date:
November 10, 2000
Export Citation:
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Assignee:
FANUC CORPORATION
International Classes:
B29C45/40; B29C45/76; (IPC1-7): B29C45/40; B29C45/76
Domestic Patent References:
JP56146713A
JP10119107A
JP10156837A
JP60190829A
JP2001300993A
JP1183657A
Attorney, Agent or Firm:
Matsumoto Takemoto (4 outside)