To make a decision whether an appropriate amount of solder is printed on a surface mounting board.
The method for measuring the quantity of solder to be printed comprises a step for measuring the weight of a board prior to solder printing by means of an electronic balance 7 and inputting the measured value to a personal computer 12, a step for measuring the weight of a board after solder printing by means of the electronic balance 7 and inputting the measured value to the personal computer 12, and a step for comparing the measurement of first step and an executed quantity of solder print with a preset theoretically appropriate quantity and presenting the comparison results on a display 13. A decision is then made whether the executed quantity of solder print is appropriate or not as compared with the theoretical quantity.
YAMAMOTO KENGO