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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR MEASURING QUANTITY OF SOLDER TO BE PRINTED
Document Type and Number:
Japanese Patent JPH09138156
Kind Code:
A
Abstract:

To make a decision whether an appropriate amount of solder is printed on a surface mounting board.

The method for measuring the quantity of solder to be printed comprises a step for measuring the weight of a board prior to solder printing by means of an electronic balance 7 and inputting the measured value to a personal computer 12, a step for measuring the weight of a board after solder printing by means of the electronic balance 7 and inputting the measured value to the personal computer 12, and a step for comparing the measurement of first step and an executed quantity of solder print with a preset theoretically appropriate quantity and presenting the comparison results on a display 13. A decision is then made whether the executed quantity of solder print is appropriate or not as compared with the theoretical quantity.


Inventors:
TANAKA SHIYOUJI
YAMAMOTO KENGO
Application Number:
JP29848795A
Publication Date:
May 27, 1997
Filing Date:
November 16, 1995
Export Citation:
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Assignee:
SONY CORP
International Classes:
G01G17/04; H05K3/12; H05K3/34; (IPC1-7): G01G17/04; H05K3/12; H05K3/34
Attorney, Agent or Firm:
Hidekuma Matsukuma