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Title:
METHOD AND APPARATUS FOR MOLDING OF EMBOSSED TAPE FOR CARRIER TAPE
Document Type and Number:
Japanese Patent JPH02121827
Kind Code:
A
Abstract:

PURPOSE: To form an embossed tape which satisfies required performance by pressurizing the tape to a lower mold having a female die through a push plate having an extended part extended at least on this side of the flange corresponding part of the tape, and supplying pneumatic air from the periphery of the female die to mold it.

CONSTITUTION: In a molding section, the lower face of a tape is supported by a molding plate 53, and first pressed to be disposed at a home position by a push plate 45 by the downward movement of an upper mold. When an upper mold is further moved down in this state, the tape is press-fitted in a female mold 54 by an emboss protrusion 42. Simultaneously, pneumatic air is injected, introduced from the recess 54a of the female die into the female die to pressurize the embossed part from outside to bring the protrusion 42 into close contact therewith to mold it. Then, even if the upper mold is raised, the flange corresponding part of the tape is still pressed by the plate 45, and separated from the tape by the further rising of the upper mold. Immediately then, the lower mold is moved down, a molded form is driven in steps, and supplied to a drilling machine 22 through a dancer roll.


Inventors:
NABETA KENJI
OGITA KATSUHISA
Application Number:
JP27536588A
Publication Date:
May 09, 1990
Filing Date:
October 31, 1988
Export Citation:
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Assignee:
DENKI KAGAKU KOGYO KK
International Classes:
B29C51/42; B29C51/08; B29C51/10; B29C59/02; H01L21/60; B29L31/00; (IPC1-7): B29C51/42; B29C59/02; H01L21/60
Attorney, Agent or Firm:
Hiroshi Nakamura



 
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