Title:
METHOD AND APPARATUS FOR MOLDING
Document Type and Number:
Japanese Patent JP2020002430
Kind Code:
A
Abstract:
To provide a method for molding adapted to improve the strength of a molded object under molding.SOLUTION: A method for molding includes a step of forming a powder layer using a first powder, an arrangement step of arranging a second powder smaller in average particle diameter than the first powder on a partial region of the powder layer, and a heating step of heating up the powder layer in which the second powder is arranged at a temperature particles contained in the second powder are sintered or fused. The second powder is a powder including a metal oxide nanoparticle containing a metal portion.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
SUGIYAMA SUSUMU
USAMI HIROICHI
USAMI HIROICHI
Application Number:
JP2018123218A
Publication Date:
January 09, 2020
Filing Date:
June 28, 2018
Export Citation:
Assignee:
CANON KK
International Classes:
B22F3/16; B22F3/105; B28B1/30; B29C64/165; B33Y10/00; B33Y30/00; B82Y30/00; B82Y40/00
Attorney, Agent or Firm:
Hidewa Patent Office
Takeshi Niwa
Takeshi Nakamura
Koichiro Sakai
Ryota Morihiro
Yoshiyuki Kawaguchi
Takeshi Niwa
Takeshi Nakamura
Koichiro Sakai
Ryota Morihiro
Yoshiyuki Kawaguchi