PURPOSE: To efficiently mount an IC component on a circuit board with high reliability by cutting separately the component formed integrally with a carrier film, mounting it directly on the board, and bonding its leads to the electrode of the board by laser heating as it is.
CONSTITUTION: A carrier film 1 is held between a punch 14 and a mounting nozzle 15, the punch 14 is driven upward as by an arrow B from this state, and an IC component 2 is separately cut while holding it at the nozzle 15. Thereafter, the nozzle 15 is raised as by arrow C, driven toward a board 3 as by an arrow E, positioned at a position directly above the IC mounting position, the nozzle 15 is moved down as by an arrow, the component 2 is mounted on the board 3, and pressurized to be fixed as it is. Then, a laser light is emitted to the leads 11 of the components 2 through the opening 19 of the nozzle 15 to thermally melt a solder on the electrode formed on the board 3, and at the lead 11 sequentially connected to the electrode.
FUKUMOTO KENJI
KABESHITA AKIRA
SUZUKI NAOKI
OTAGAKI TOMOKO
TANAKA KURAHEI
| JPS62101097A | 1987-05-11 |