PURPOSE: To manufacture a mounting product of a semiconductor device having no generation of dust due to cutting, peeling of a cover tape, no stop of an apparatus due to reconnection of the tape, a high operability and no conducting malfunction due to dust, and high quality in the step of mounting by a taping element.

CONSTITUTION: The apparatus for mounting a semiconductor device by a taping element comprises a reel-like taping element supply unit, a tape pitch feeding unit 10, a cutting unit for a thermally press-bonded part of an embossed tape 2 and a cover tape 3 such as a cutter, etc., a thermally press-bonded part containing unit for containing the cut press-bonded part, a winding unit for the tape 3, a sucking 9 and conveying unit 9 for removing a semiconductor device from a pocket of the tape 2 in which the cover tape is removed and transferring it to a board, and a tape containing unit for winding the embossed tape which becomes vacant.