To make all the suction holes suck solder balls with reliability by lowering a suction head, where a plurality of suction holes having recesses on the suction side, the depth of which is 1/2 of solder ball radius or below, are formed in specified positions, into a solder ball housing case, and thereby making the recess suck solder balls.

A suction head 1 includes a suction pad 5 where a plurality of suction holes having on the suction side recesses the depth of which is 1/2 of solder ball B radius or below are formed in positions corresponding to places where solder balls are to be bonded. The suction head 1 is connected with a vacuum pump 6. When a switch is turned on, the suction head 1 goes down into a chamber 2, where solder balls B are sucked by the recesses in all the suction holes. A detector 7 detects that, and the suction head 1 goes up to a specified position and then horizontally moves. This prevents fine powder from being sucked first and clogging the suction holes.