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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR PLASMA TREATMENT
Document Type and Number:
Japanese Patent JPH11135439
Kind Code:
A
Abstract:

To provide a method and an apparatus for plasma treatment that can reduce spherical protrusions existent on the surface of a functional deposited film, particularly a photosensitive material for electrophotography.

A reaction chamber 1 which can be decompressed is possible is provided with cathodes 2 and a member to hold the both edges of a substrate to be treated. High-frequency power generated by the high-frequency power supply 6 is supplied to the cathodes 2 to generate plasma between the cathodes 2 and the member holding the substrate 3 or the substrate 3 held by the member, subsequently forming a deposited film on the substrate. In this plasma treatment method or apparatus, the length of the cathode 2 is shorter than that of the member holding the substrate 3. The high-frequency power generated by the high-frequency power supply 6 is divided and supplied to each cathode.


Inventors:
TERANISHI KOJI
YAMAGAMI ATSUSHI
TAKAGI SATOSHI
Application Number:
JP31266397A
Publication Date:
May 21, 1999
Filing Date:
October 29, 1997
Export Citation:
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Assignee:
CANON KK
International Classes:
G03G5/00; C23C16/44; C23C16/50; G03G5/08; H01L21/205; H01L31/04; (IPC1-7): H01L21/205; C23C16/44; C23C16/50; G03G5/00; G03G5/08; H01L31/04
Attorney, Agent or Firm:
Tatsuya Nagao