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Title:
METHOD AND APPARATUS FOR PLOTTING ELECTRON BEAM AND SEMICONDUCTOR-MANUFACTURING METHOD USING THEM
Document Type and Number:
Japanese Patent JP3940310
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide an accurate and high-speed electron beam-plotting technique for carrying out the position correction of each beam without using reflector arrays or enormous and precise drive circuits in a multi-beam plotting system.
SOLUTION: In the electron beam-plotting technique for independently turning on and off each of a plurality of electron beams for scanning to plot a desired pattern on a sample, the deviation between a pattern that is plotted by each of the plurality of electron beams and the desired pattern to be plotted is controlled by shifting the position of pattern data that are drawn by each of the plurality of electron beams.


Inventors:
Hiroya Ota
Yasunari Hayada
Saito Toku ro
Haruo Yoda
Keisei Yui
Shinichi Hashimoto
Application Number:
JP2002102789A
Publication Date:
July 04, 2007
Filing Date:
April 04, 2002
Export Citation:
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Assignee:
Hitachi High-Technologies Corporation
Canon Inc
Advantest Corporation
International Classes:
H01L21/027; H01J37/08; H01J37/30; H01J37/302; H01J37/304; H01J37/317; (IPC1-7): H01L21/027
Domestic Patent References:
JP2001267221A
JP59107512A
JP1200622A
JP5206017A
Attorney, Agent or Firm:
Polaire Patent Business Corporation