Title:
METHOD AND APPARATUS FOR POSITIONING DISC-SHAPED BODY
Document Type and Number:
Japanese Patent JP3662357
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a method and apparatus for positioning a disc-shaped body whereby its accurate positioning is realized by an automatic control with a simple configuration.
SOLUTION: Putting a wafer (disc-shaped body) 10 on a rotational stage 2 whose center of rotation is present on a positioning point, the distance ranging from the center of rotation to the peripheral edge of the wafer 10 is measured every predetermined rotational angle by a distance measuring sensor 8 to compute both the discrepant angle and discrepant distance between the center of rotation and the center of the wafer 10. After rotating the rotational stage 2 by the discrepant angle, in the state of removing temporaily the wafer 10 from the rotational stage 2, the rotation of the rotational stage 2 is transmitted to a cam 4 by a clutch 5 to move linearly the rotational stage 2 by the discrepant distance. Then, when putting again the wafer 10 on the rotational stage 2, since the center of the wafer 10 coincides with the center of rotation, the positioning of the wafer 10 is performed by returning the rotational stage 2 to its original position through the cam 4.
Inventors:
Ide Matsuda
Hideo Haraguchi
Shigeyuki Yamamoto
Masashi Matsumori
Minako Yukihiro
Hideo Haraguchi
Shigeyuki Yamamoto
Masashi Matsumori
Minako Yukihiro
Application Number:
JP22540096A
Publication Date:
June 22, 2005
Filing Date:
August 27, 1996
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H01L21/68; (IPC1-7): H01L21/68
Domestic Patent References:
| JP5343501A | ||||
| JP1164047A |
Attorney, Agent or Firm:
Masaru Ishihara