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Title:
METHOD AND APPARATUS FOR PRODUCING COPPER OR COPPER ALLOY INGOT HAVING SMOOTH SURFACE WITHOUT SHRINKAGE CAVITY AND SURFACE FOLD
Document Type and Number:
Japanese Patent JP2001347356
Kind Code:
A
Abstract:

To provide a method and an apparatus for producing a copper or a copper alloy ingot having no shrinkage cavity and smooth surface and no fold and particularly, the method and the apparatus for producing the high purity copper ingot having ≥99.9999 wt.% purity and no shrinkage cavity and smooth surface and no fold.

This method is performed by heating so as to have such temperature gradient as to become high temperature from the bottom wall of a mold toward the upper direction and pouring molten copper or molten copper alloy into the mold arranging a cooling base seat at the bottom part and solidifying this molten copper or molten copper alloy into one direction. Then, the cooling base seat 4, the mold 1 laid on the cooling base seat 4 and a heating furnace 2 arranged surrounding the mold 1, are provided, and the heating furnace 2 can be controlled to the heating so as to have such temperature gradient as to become high temperature from the bottom part of the mold toward the upper part.


Inventors:
YAJIMA KENJI
ISHIDA TOKUKAZU
FURUSHIBA YUTAKA
NOGAMI TAKASHI
KAKIMOTO AKIHIRO
Application Number:
JP2000170762A
Publication Date:
December 18, 2001
Filing Date:
June 07, 2000
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B22D5/00; B22D21/00; B22D27/04; (IPC1-7): B22D27/04; B22D5/00; B22D21/00
Attorney, Agent or Firm:
Kazuo Tomita (1 person outside)