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Title:
METHOD AND APPARATUS FOR PRODUCING UNEVEN THICKNESS RESIN SHEET
Document Type and Number:
Japanese Patent JP2010179489
Kind Code:
A
Abstract:

To provide a method and an apparatus for manufacturing an uneven thickness resin sheet which can prevent defective cutting and the peeling of a protective film during the cutting of the uneven thickness resin sheet.

In the method for producing the uneven thickness resin sheet, a molten resin extruded from a die 16 is pressed between a mold roller 20 and a nip roller 18 to mold the uneven thickness resin sheet S. The sheet S, after being peeled off from the mold roller 20 by a peeling roller 22, is cut in a desired length by a cutter 32. The sheet S is cut while the sheet S is pushed by an elastic body whose shape is adjusted in advance according to the sheet S. In this way, since the sheet S can be cut while being pushed by the elastic body over its entire width, the defective cutting of the sheet S and the peeling of the protective film can be prevented.


Inventors:
SANO DAISUKE
KATSUMOTO RYUICHI
SANO YOSHIHIKO
Application Number:
JP2009022853A
Publication Date:
August 19, 2010
Filing Date:
February 03, 2009
Export Citation:
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Assignee:
FUJIFILM CORP
International Classes:
B26D7/04; B26D7/18; B29C48/08; B29C48/12; B29C48/305; C08J5/18; G02B3/00; G02B3/06; B29L7/00
Attorney, Agent or Firm:
Kenzo Matsuura