METHOD AND APPARATUS FOR RECOVERING SOLDER

Title:

METHOD AND APPARATUS FOR RECOVERING SOLDER

Document Type and Number:

Japanese Patent JP2005344204

Kind Code:

A

Abstract:

To recover solder from dross floating on molten solder in a solder bath in a short period of time at high recovery rate.

The solder recovery apparatus 10 is an apparatus for recovering the solder by vacuum-sucking the dross 3 floating on the molten solder 2 in the solder bath 1. This apparatus 10 comprises: a suction section 20 for a suction nozzle 21; a spray section 30 for causing steam explosion by spraying water onto the dross 3 sucked via the suction nozzle 21 to pulverize the dross 3 into dross particles 3a and solder particles 2a; a separation section 40 for separating the dross particles 3a from the solder particles 2a by the difference in specific gravity; and a recovery section 50 for separately recovering the separated dross particles 3a and the solder particles 2a in containers 51 and 52, respectively. Further, in the apparatus 10, a cart-type main body 11 freely movable on the floor is equipped with the above sections.

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Inventors:

IWASAKI RYUJI

Application Number:

JP2004168947A

Publication Date:

December 15, 2005

Filing Date:

June 07, 2004

Export Citation:

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Assignee:

WAKO GIKEN KK

International Classes:

C22B7/04; C22B9/02; C23C2/00; C23C2/08; F27D3/15; (IPC1-7): C22B7/04; C22B9/02; C23C2/00; C23C2/08; F27D3/15

Attorney, Agent or Firm:

Shogo Ehara
Hideka Tanaka
Yoshiyuki Shiraishi
Kunihiko Shiromura
Tsuyoshi Kumano
Hiroaki Yamane

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