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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR RECOVERING SOLDER
Document Type and Number:
Japanese Patent JPH11229048
Kind Code:
A
Abstract:

To dispore a container with solder parts left in it without scarcely causing a pollution problem by heating the container and waste cloth stained with solder paste and solder on a grate at a specific temp. or higher, buring it up and also, recovering the molten solder at the lower part of the grate.

At the time of charging the vessel, etc., P sticking the paste into the receiving part 9 in a recovering apparatus, a charging box 17 is lowered downward along an elevating/lowering rail 16, and an outer door 10 is closed. Simultaneously, an inner door 11 is opened and the vessel, etc., P sticking the paste in the receiving part 9 is charged in the inner part of the apparatus 1. The vessel etc., P sticking the paste is laid on the grate 5 and burnt up at ≥800°C with the flame of a burner 7. Since the solder paste, the solid solder, etc., are melted at ≤200°C, these materials are perfectly melted at the time of burning of the vessel, etc., P sticking the paste, and the molten solder is dropped downward from the holes 6 of the grate 5 and deposited on the inclined furnace hearth 2.


Inventors:
TAKAHASHI KOZO
Application Number:
JP4421098A
Publication Date:
August 24, 1999
Filing Date:
February 12, 1998
Export Citation:
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Assignee:
SENJU METAL INDUSTRY CO
TAKAHASHI GOKIN KK
International Classes:
B23K1/00; C22B7/00; H05K3/34; (IPC1-7): C22B7/00