Title:
高分子化合物の除去方法及び高分子化合物の除去装置
Document Type and Number:
Japanese Patent JP7197119
Kind Code:
B2
Abstract:
To provide a removal method for a support material capable of sufficiently removing a support material and having short removing work time.SOLUTION: A support material removal method 200 is a method for recovering a model material by removing a support material SP from a three-dimensional formed object X, and includes: a dipping step 210 for dipping the three-dimensional formed object X in a cleaning liquid CL; a support material melting step 220 for melting the support material; a cleaning tank separation step 230 for separating the support material SP and the cleaning liquid CL in a cleaning tank 10; an overflow step 240 for overflowing the liquid from the cleaning tank 10; a recovery step 250 for recovering the liquid overflown from the cleaning tank 10 in a recovery tank 50; a recovery tank separation step 260 for separating the support material SP and the cleaning liquid CL in the recovery tank 50; and a support material recovery step 270 for recovering the separated support material SP.SELECTED DRAWING: Figure 2
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Inventors:
Tatsuhiro Nemoto
Application Number:
JP2018210214A
Publication Date:
December 27, 2022
Filing Date:
November 08, 2018
Export Citation:
Assignee:
Keiyo Chemical Co., Ltd.
International Classes:
B29C64/40; B08B3/12; B33Y40/00; B33Y40/20
Domestic Patent References:
| JP2015229248A | ||||
| JP2017030211A | ||||
| JP2006100717A | ||||
| JP62250964A | ||||
| JP58034182A | ||||
| JP2007002090A |
Foreign References:
| WO2016147995A1 |
Attorney, Agent or Firm:
Kameyama Natsuki
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