To provide a method and an apparatus for removing and/or preventing surface contamination of a probe for testing a semiconductor wafer.

The probe 106 is positioned so as to penetrate a chamber 30 formed with the wall part of the main part 14 of a cover part 12, an insulator 18, and a part of a probe arm 110. An inlet passage 18 communicated with the chamber 30 is formed in the main part 14, further an outlet passage 20 communicated with the chamber 30 is formed at the base part 23 of the cover part 12. A gas is caused to flow through the inlet passage 18, the chamber 30, the outlet passage 20, and in the surrounding of the distal end 112 of the probe 106, and to remove and/or prevent the surface contamination of the probe.