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Title:
METHOD AND APPARATUS FOR RESIN SEALING MOLD OF ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JP02141217
Kind Code:
A
Abstract:

PURPOSE: To enable a high quality and high reliability resin sealing molding to be manufactured with high efficiency by applying required vibration to a plunger during the time of pressurizing period of a resin material by the plunger, and applying a required vibration effect to be resin material via the plunger.

CONSTITUTION: A lead frame mounted with electronic parts is set on a predetermined position in the P.L surface of a lower mold 2, and resin materials R are supplied respectively into the each spot 3 of the lower mold 2, and the mold clamping of both upper and lower molds is conducted then. At this time, a load meter 18, vibrator 10, disengaging member 9, plunger holder 7 and respective plungers 4 move upward simultaneously. And, in the time of resin sealing mold, the vibrator 10 is actuated at least when each plunger 4 pressurizing respectively the resin materials R within the each spot 3 moves upward, and each of plungers 4 receives a predetermined vibration via the plunger holder 7.


Inventors:
Osada, Michio
Application Number:
JP1988000295528
Publication Date:
May 30, 1990
Filing Date:
November 21, 1988
Export Citation:
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Assignee:
T & K INTERNATL KENKYUSHO:KK
International Classes:
B29C45/02; B29C45/14; B29C45/26; B29C45/58; H01L21/56; B29L31/34; (IPC1-7): B29C45/02; B29C45/14; B29C45/26; B29L31/34; H01L21/56