To supply a solder, which has a predetermined thickness and is evenly distributed throughout the entire surface of a semiconductor chip when the semiconductor chip is mounted on a metal substrate, also called a lead frame.

An apparatus for supplying a flux free solder comprises a dispenser head 2 having a stamp 5 that can irradiate an ultrasonic wave. A method for supplying solder comprises the steps of A) moving the dispenser head 2 above the next substrate portion, B) moving down the stamp 5 until an operation surface 11 comes into contact with the substrate portion, C) supplying solder in such a manner as to C1) feed the tip of a solder wire comes into contact with the substrate portion in a concave part 12 of the stamp 5, C2) feed the solder wire 8 further so that a predetermined amount of the solder is melted, and C3) pull back the solder wire 8, D) irradiating the ultrasonic wave on the stamp 5, and E) moving up the stamp 5.