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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR TESTING IMPACT BONDING STRENGTH OF ADHESIVE
Document Type and Number:
Japanese Patent JPH09281032
Kind Code:
A
Abstract:

To provide a method and its apparatus in which the impact bonding strength of an adhesive is measured at a low temperature.

In the test method for the impact bonding strength of an adhesive, a bonding test object which is formed in such a way that opposite faces of an object to be impacted and an object to be bonded are bonded with an adhesive to be tested is immersed in a cooling liquid 88 so as to be cooled down to a prescribed temperature. Then, by a pulling-up means 64 which makes use of the elastic force of an elastic body, the cooled bonding test object is pulled up quickly from the cooling liquid, the bonding test object is moved in a shape that the object to be impacted is directed toward the outside along a route 20 drawing an arc approximately, and the object to be impacted is positioned in an impacted position 18 in which it is arranged to be higher than the object to be bonded. Immediately after the bonding test object has been positioned in the impact position, an arm 46 of a pendulum-type impact device 14 is turned freely by gravity around the rotation center 44, an impact arm is made to collide with the object to be impacted of the bonding test object, the object to be impacted is removed from the object to be bonded, and the angle of rotation of the arm which is turned further upward after is impact is measured.


Inventors:
AOKI SHIGERU
SASANO KATSUJI
NONAMI OSAMU
Application Number:
JP11846196A
Publication Date:
October 31, 1997
Filing Date:
April 16, 1996
Export Citation:
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Assignee:
CHIYODA CHEM ENG CONSTRUCT CO
International Classes:
G01N19/04; G01N3/30; (IPC1-7): G01N19/04; G01N3/30
Attorney, Agent or Firm:
大澤 斌 (外2名)