METHOD AND APPARATUS FOR TREATING SUBSTRATE

Title:

METHOD AND APPARATUS FOR TREATING SUBSTRATE

Document Type and Number:

Japanese Patent JP2003017452

Kind Code:

A

Abstract:

To provide a method and an apparatus for treating a substrate, capable of completely treating the substrate, in simple apparatus constitution and steps.

The method for treating the substrate comprises a first step of holding the substrate by contacting a holder 14 with a peripheral edge of the substrate W, a first substrate treating step of supplying a treatment liquid to the substrate held by the holder and treating the substrate, a holding cancelling step of releasing the holding by the first holding step, a second holding step of contacting the substrate at a different contact position from the contact position of the first holding step and holding the substrate, and a second substrate treating step of supplying the liquid to the substrate and treating the substrate, after the second holding step. Accordingly, the effect of completely treating the entire surface of the substrate, by reholding the substrate after only the substrate is rotated, by releasing the holding of the substrate, after treating it once and treatment of the substrate, is obtained.

Inventors:

Morisawa, Shinya

Application Number:

JP2001000200848

Publication Date:

January 17, 2003

Filing Date:

July 02, 2001

Export Citation:

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Assignee:

EBARA CORP

International Classes:

B08B3/02; B08B3/12; H01L21/304; H01L21/68; H01L21/683; B08B3/02; B08B3/12; H01L21/02; H01L21/67; (IPC1-7): H01L21/304; B08B3/02; B08B3/12; H01L21/68

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