METHOD AND APPARATUS FOR VISUAL INSPECTION

Japanese Patent JPH05272938

A

PURPOSE:To inspect the soldered state by casting light beams on a material to be inspected at the different angles, picking up the images from the direct upper side and the slant upper side, respectively, obtaining the size and the shape of the object, extracting the characteristics of the data pattern, judging the definite good part and the defective part, and judging the ambiguous boundary value and shape data pattern. CONSTITUTION:Lighting parts 11, 13, 15 and 17 are arranged in four stages at the upper side of an object to be inspected. An image sensing camera 21 is arranged at the direct upper side of the object 3, and image sensing cameras 22 and 23 are arranged at the slant upper side. The output signals of the camera 21 and the cameras 22 and 23 are inputted into 38 image memory parts 5 and 5'. The outputs of the memory parts 5 and 5' are inputted into image operating and processing parts 6 and 6'. In the processing parts 6 and 6', the images having the highest illuminance level are selected and inputted into shape data parts 7 and 7'. The images are coded and inputted into a recognizing and judging part 8. In the judging part 8, the size, shape and the like of a soldered part are computed. At first, the definite good product and the defective product are distinguished. For the remaining part, the ambiguous boundary value and shape data pattern are extracted in the characteristics of details, and the complete judgment is performed. Thus, the soldered state is adequately judged.

Hayashi Seiichi
Nakanishi Masajo
Kiyasu Takeyasu

JP9868692A

October 22, 1993

March 25, 1992

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Hitachi Electronics Co., Ltd.

G01B11/24; G01B11/245; G01N21/88; G01N21/956; G06T1/00; H05K3/34; (IPC1-7): G01B11/24; G01N21/88; G06F15/62

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