Title:
METHOD AND APPARATUS FOR WASHING POLISHING PLATE AND METHOD FOR POLISHING WAFER
Document Type and Number:
Japanese Patent JP2002170798
Kind Code:
A
Abstract:
To provide a method for washing a polishing plate capable of washing the top surface of a polishing plate efficiently and uniformly by using jetted water under pressure for washing.
A nozzle 20 is oppositely faced with a wafer holding surface 11 of a polishing plate P, and the water is jetted from the nozzle 20 while the nozzle 20 and the plate P are relatively moved. Then, the water is splashed onto the surface 11 to wash the plate P.
Inventors:
KAWAZUMI MASANORI
MIZUNO MICHIHIKO
MIYASHITA AKIRA
KASHIMURA NORIO
MIZUNO MICHIHIKO
MIYASHITA AKIRA
KASHIMURA NORIO
Application Number:
JP2000363773A
Publication Date:
June 14, 2002
Filing Date:
November 29, 2000
Export Citation:
Assignee:
SHINETSU HANDOTAI KK
International Classes:
B08B3/02; B24B55/06; H01L21/304; (IPC1-7): H01L21/304; B08B3/02; B24B55/06
Domestic Patent References:
| JPH10256199A | 1998-09-25 | |||
| JPH0417332A | 1992-01-22 | |||
| JPH11297808A | 1999-10-29 | |||
| JPH1133503A | 1999-02-09 | |||
| JPH1144877A | 1999-02-16 | |||
| JPH0919667A | 1997-01-21 | |||
| JPH10308370A | 1998-11-17 |
Attorney, Agent or Firm:
Masahisa Takahashi (1 person outside)